Innovium announces OCP SAI and open-source SONiC solution to accelerate TERALYNX™ market adoption

Addresses SAI & SONiC demand from OEM & Cloud customers

San Jose, CA – March 20, 2018 – Innovium, Inc. a leading provider of networking solutions for data centers, today announced that it supports Open Compute Project (OCP) based Switch Abstraction Interface (SAI) APIs, enabling easier integration of its TERALYNX™ switch silicon and network operating systems (NOSes) using industry standards. Further, Innovium announced support for Software for Open Networking in the Cloud (SONiC), a leading open-source network OS using SAI APIs to accelerate adoption of TERALYNX™ among data center customers.
“Switch Abstraction Interface (SAI) provides our customers an open standards solution for our industry leading switch silicon,” said Rajiv Khemani, CEO and Co-founder of Innovium. “SONiC is the leading open-source software network platform in the industry and leverages SAI. Several of our OEM and cloud customers have specifically asked us for SONiC and SAI support to evaluate and deploy TERALYNX™ based solutions. We are pleased to offer an industry leading performance SONiC solution using our 12.8Tbps TERALYNX™ to enable superior quality large-scale networks.”

Microsoft’s (NASDAQ: MSFT) SONiC, is a breakthrough open-source network OS to simplify switch operations and management. SONiC is a uniquely extensible platform, with a large and growing ecosystem of hardware and software partners. “OCP Switch Abstraction Interface provides customers an open, modern and extensible interface to abstract switch silicon and enables SONiC to adopt innovative switch silicon faster,” said Yousef Khalidi, Corporate Vice President, Azure Networking at Microsoft Corp. “We’re excited to see Innovium support for OCP SAI & SONiC and their commitment to its future.”

The Innovium TERALYNX™ product line delivers an industry leading Ethernet switch silicon family with leading analytics, programmability, and power efficiency. TERALYNXTM is the industry’s first switch that achieves 12.8 Terabits per second (Tbps) performance in a single-chip, while delivering robust tunneling, large buffers, and line-rate programmability.

Innovium plans to demonstrate SAI and SONiC support for TERALYNX™ at the Open Compute Summit on March 20-21, 2018. Please contact [email protected] to schedule an appointment for a demo.

About Innovium

Innovium is a provider of high performance, innovative switching silicon solutions for data centers. Innovium TERALYNX™ family delivers software compatible products ranging from 3.2Tbps to 12.8Tbps with unmatched power efficiency, radix, programmability, buffers and low latency. Innovium team members have a highly successful track record in delivering several generations of widely deployed data center products. The company is headquartered in Silicon Valley, California and is backed by leading venture capital firms including Greylock Partners, Walden Riverwood, Capricorn Investment Group, Qualcomm Ventures, S-Cubed Capital and Redline Capital. For more information, please visit: http://www.innovium.com

Innovium Contact:
Amit Sanyal
408-385-7733